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In page Wafer (electronics):
"A unit of wafer fabrication step, such as an etch step, can produce more chips proportional to the increase in wafer area, while the cost of the unit fabrication step goes up more slowly than the wafer area. This was the cost basis for increasing wafer size. Conversion to 300 mm wafers from 200 mm wafers began in early 2000, and reduced the price per die for about 30–40%.[citation needed]Larger diameter wafers allow for more die per wafer.
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