Citation Hunt

Leaderboard

The Wikipedia snippet below is not backed by a reliable source. Can you find one?

Click I got this! to go to Wikipedia and fix the snippet, or Next! to see another one. Good luck!

In page Copper interconnects:

"

In this process, the underlying silicon oxide insulating layer is patterned with open trenches where the conductor should be. A thick coating of copper that significantly overfills the trenches is deposited on the insulator, and chemical-mechanical planarization (CMP) is used to remove the copper (known as overburden) that extends above the top of the insulating layer. Copper sunken within the trenches of the insulating layer is not removed and becomes the patterned conductor. Damascene processes generally form and fill a single feature with copper per Damascene stage. Dual-Damascene processes generally form and fill two features with copper at once, e.g., a trench overlying a via may both be filled with a single copper deposition using dual-Damascene.[citation needed]